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Engineer Failure Analysis

Infineon

Описание

Perform up to medium level of Discrete Failure Analysis [FA] on wafer and package level starting from electrical verification, fault isolation and physical root cause analysis. Prepare FA reports that can lead to root cause finding and corrective action to cross functional team. Participate and present FA results in cross functional meetings, projects, yield improvement, urgent and important meetings. FA equipment / tool ownership. Interface with designers, test, product, process integration and unit process engineers, problem solving team, CQM (customer quality management) team to understand the analysis requirement. Responsible for achieving EFA KPIs. Responsible for Fault Tree Analysis (FTA) in case of no physical defect found. Qualification: Degree / Master / Ph D in Electrical and Electronic Engineering 1) Electrical failure verification and fault localization using I-V characterization, functional testing, OBIRCH, TIVA, and SEI. 2) Sample preparation for failure analysis, including wet/dry chemical processes, backside preparation, cross-sectioning, and package preparation. 3) Defect imaging and characterization using Optical Microscopy, SEM, and FIB (including Voltage Contrast techniques). 4) Practical knowledge of semiconductor manufacturing processes, device physics, fabrication technologies, and testing methodologies. WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables…

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