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Lead Principal Engineer Technology Integration

Infineon

Описание

Lead Package Business Case (PBC) and Technology Project Case (TPC) assessments, providing technical evaluations, integration readiness assessments, and risk mitigation recommendations. Drive Package Technology Design Failure Mode and Effects Analysis (DFMEA) activities to systematically identify, assess, and mitigate technology and process-related risks. Own and lead risk interaction assessment and mitigation work packages, ensuring potential process and material interactions are identified and addressed early in development. Drive the integration of unit processes, Bills of Materials (BOM), and process flows within package platforms, including interaction studies, process compatibility assessments, and manufacturing risk evaluations. Act as the key technical partner for Front-End (FE) and Back-End (BE) integration activities, supporting FE/BE and BE/BE interaction topics throughout product and technology development. Support pre-development initiatives for emerging chip and package technologies through feasibility assessments, technology evaluations, and integration studies. Lead or contribute to structured problem-solving activities using methodologies such as 8D, Fishbone Analysis, Fault Tree Analysis (FTA), and Root Cause Analysis (RCA) to resolve technology interaction issues. Assess the impact of package design rules and process requirements on inter-process interactions, product performance, manufacturability, and reliability. Provide subject matter expertise…

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